115學年材料系-第十週 專題研討課程 演講公告 (115年5月7日)
2026.05.05
115學年材料系-第十週 專題研討課程 演講公告 (115年5月7日)
題目: MICAtronics: Mastering van der Waals Interfaces from Fundamental Slip Dynamics to Thermal-Energy Heterostructures
講者：朱英豪 博士
現職：國立清華大學材料科學工程學系 系主任兼講座教授 / 中央研究院物理研究所 合聘研究員
時間：5/7 (四) 15:20~17:10
地點: 成功大學 成功校區 三系館 鋼構區 (3F) 共同教室 A1302 演講廳
內容摘要:
Two-dimensional (2D) muscovite mica offers a perfect macroscopic platform for next-generation flexible electronics, termed "MICAtronics". This talk presents a comprehensive materials engineering framework, progressing from fundamental atomic slip dynamics to advanced thermal-energy heterostructures. First, we elucidate mica's anisotropic mechanics using focused ion beam-milled micropillars, identifying continuous shear sliding along the [100] direction. Through alkali-ion intercalation, we successfully decoupled interlayer shear resistance from in-plane structural stiffness. Building on this mechanically tunable platform, we integrated 3D metals onto 2D mica via quasi-van der Waals epitaxy. This robust heterointerface endures >10⁵ bending cycles and leverages thermal expansion mismatches to achieve giant thermal actuation (curvature up to 264 m⁻¹). Finally, we translated this intense thermal-mechanical coupling into a flexible polyvinylidene fluoride (PVDF)/mica bimorph. By harnessing massive interfacial thermal stresses driven by significant thermal-expansion mismatches, we engineered a dominant secondary pyroelectric contribution. This stress-mediated mechanism yields a giant pyroelectric coefficient of ~ -359 µC/m²K, over ten times higher than single-layer PVDF. Ultimately, these studies highlight cross-dimensional interface engineering for high-performance flexible electronics and energy harvesting applications.
題目: MICAtronics: Mastering van der Waals Interfaces from Fundamental Slip Dynamics to Thermal-Energy Heterostructures
講者：朱英豪 博士
現職：國立清華大學材料科學工程學系 系主任兼講座教授 / 中央研究院物理研究所 合聘研究員
時間：5/7 (四) 15:20~17:10
地點: 成功大學 成功校區 三系館 鋼構區 (3F) 共同教室 A1302 演講廳
內容摘要:
Two-dimensional (2D) muscovite mica offers a perfect macroscopic platform for next-generation flexible electronics, termed "MICAtronics". This talk presents a comprehensive materials engineering framework, progressing from fundamental atomic slip dynamics to advanced thermal-energy heterostructures. First, we elucidate mica's anisotropic mechanics using focused ion beam-milled micropillars, identifying continuous shear sliding along the [100] direction. Through alkali-ion intercalation, we successfully decoupled interlayer shear resistance from in-plane structural stiffness. Building on this mechanically tunable platform, we integrated 3D metals onto 2D mica via quasi-van der Waals epitaxy. This robust heterointerface endures >10⁵ bending cycles and leverages thermal expansion mismatches to achieve giant thermal actuation (curvature up to 264 m⁻¹). Finally, we translated this intense thermal-mechanical coupling into a flexible polyvinylidene fluoride (PVDF)/mica bimorph. By harnessing massive interfacial thermal stresses driven by significant thermal-expansion mismatches, we engineered a dominant secondary pyroelectric contribution. This stress-mediated mechanism yields a giant pyroelectric coefficient of ~ -359 µC/m²K, over ten times higher than single-layer PVDF. Ultimately, these studies highlight cross-dimensional interface engineering for high-performance flexible electronics and energy harvesting applications.