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名譽教授

名譽教授

最後更新日：2026/06/16
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林光隆 名譽教授

大頭照-林光隆

林光隆 名譽教授

聯絡電話： (06) 275-7575 ext.62929
電子信箱：matkllin@mail.ncku.edu.tw
實驗室：電子構裝實驗室
個人網站：網站連結
研究專長：材料表面工程、電子構裝材料與技術、銲錫材料與技術
學術成大：
連結至學術成大系統 - 林光隆
  • 期刊論文
  • 研討會論文
  • 專書著作

期刊論文

  1. Ying-Ta Chiu*;Kwang-Lung Lin;Albert T. Wu;Wei-Luen Jang;Chung-Li Dong;Yi-Shao Lai,"Electrorecrystallization of Metal Alloy",J Alloy and Compound;vol : 549, no : , pp : 190- 194(SCI 01 2013)[link]
  2. Yu-Wei Lin*;Kwang-Lung Lin,"Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow",Intermetallics;vol : 32, no : , pp : 6- 11(SCI 01 2013)[link]
  3. Nai-Shuo Liu*;Kwang-Lung Lin,"Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders",Oxidation of Metals;vol : 78, no : 5-6, pp : 285- 294(SCI 12 2012)[link]
  4. Kwang-Lung Lin*;Yu-Wei Lin;Chang-Ho Yu,"The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process",JOM (The Journal of The Minerals, Metals & Materials Society );vol : 64, no : 10, pp : 1184- 1189(SCI 10 2012)[link]
  5. Wei-Yu Chen*;Tsung-Chieh Chiu;Kwang-Lung Lin;Yi-Shao Lai,"Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint",Intermetallics;vol : 26, no : , pp : 40- 43(SCI 07 2012)[link]
  6. Jagjiwan Mittal;Kwang Lung Lin*,"Diffusion of Cu and interfacial reactions during reflow of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga alloy on Ni/Cu substrate",Journal of Materials Research;vol : 27, no : 8, pp : 1142- 1148(SCI 04 2012)[link]
  7. Wei-Luen Jang;Tai-Siang Wang;Yen-Fen Lai;Kwang-Lung Lin*;Yi-Shao Lai,"The performance and fracture mechanism of solder joints under mechanical reliability test",Microelectronics Reliability;, pp : http://dx.doi.org/10.1016/j.mi- (SCI 04 2012)[link]
  8. Ying-Ta Chiu;Kwang-Lung Lin*;Yi-Shao Lai,"Dissolution of Sn in a SnPb solder bump under current stressing",Journal of Applied Physics;vol : 111, no : , pp : 043517- (SCI 02 2012)[link]
  9. Tsung-Chieh Chiu*;Kwang-Lung Lin,"The Growth of Intermetallic Compound in Cu/Sn3.5Ag/Au Solder Joints under Current Stressing",Intermetallics;vol : 23, no : , pp : 208- 216(SCI 04 2012)[link]
  10. YU-HSIANG HSIAO*;KWANG-LUNG LIN;CHIU-WEN LEE;YU-HSIU SHAO;YI-SHAO LAI,"Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates",Journal of Electronic Materials;vol : 41, no : 12, pp : 3368- 3374(SCI 12 2012)[link]
  11. De-Shin Liu;Chang-Lin Hsu*;Chia-Yuan Kuo;Ya-Ling Huang;Kwang-Lung Lin;Geng-Shin Shen,"A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints",Soldering & Surface Mount Technology;vol : 24, no : 1, pp : 22- 29(SCI 01 2012)[link]
  12. P. J. Tsai;T. C. Chiu;P. H. Tsai;K. L. Lin;K. S. Lin;S. L. I. Chan*,"Carbon nanotube buckypaper/MmNi5 composite film as anode for Ni/MH batteriesCarbon nanotube buckypaper/MmNi5 composite film as anode for Ni/MH batteries",International Journal of Hydrogen Energy;vol : 37, no : 4, pp : 3494- 3499(SCI 02 2012)[link]
  13. Ying-Ta Chiu*;Chia-Hao Liu;Kwang-Lung Lin;Yi-Shao Lai,"Supersaturation Induced by Current Stressing",Scripta Materialia;vol : 65, no : , pp : 615- 617(SCI 07 2011)[link]
  14. Jagjiwan Mittal;Kwang Lung Lin*,"The formation of electric circuits with carbon nanotubes and copper using tin solder",CARBON;vol : 49, no : , pp : 4385- 4391(SCI 06 2011)[link]
  15. Chau, J.L.H.;Chen, C.-Y.;Yang, M.-C.;Lin, K.-L.;Sato, S.;Nakamura, T.;Yang, C.-C.;Cheng, C.-W.,"Femtosecond laser synthesis of bimetallic Pt-Au nanoparticles",Materials Letters;vol : 65, no : 4, pp : 804- 807(SCI 02 2011)[link]
  16. Wei-Luen Jang*;Tsung-Chieh Chiu;Kwang-Lun Lin,"Effect of Thermal Cycles on Adhesion Strength of Ag/Ni/Ti film on AlN Substrate",Thin Solid Films;vol : 519, no : 16, pp : 5539- 5543(SCI 06 2011)[link]
  17. Chien-Cheng Pan;Kwang-Lung Lin,"The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate",JOURNAL OF APPLIED PHYSICS;vol : 109, no : 103513, pp : 103513-1- 103513-4(SCI2011)[link]
  18. Yu-Wei Lin;Kwang-Lung Lin,"The early stage dissolution of Ni and the nucleation of Ni-Sn intermetallic compound at the interface during the soldering of Sn-3.5Ag on a Ni substrate",JOURNAL OF APPLIED PHYSICS; JOURNAL OF APPLIED PHYSICSvol : 108, no : 6, pp : 063536- (SCI 09 2010)[link]
  19. Y.L. Huang;K.L. Lin;D.S. Liu,"Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 25, no : 7, pp : 1312- 1320(SCI 07 2010)[link]
  20. J. Mittal;K.L. Lin,"Activities during melting and reflowing behaviour of solders",Soldering & Surface Mount Technology;Soldering & Surface Mount Technologyvol : 22, no : 1, pp : 4- 10(SCI2010)[link]
  21. Jagjiwan Mittal;Yu Wei Lin;Kwang Lung Lin,"Influence of Cu substrate surface oxides and heating rates during reflow on melting point of Sn–3.5Ag solder",Applied Surface Science; Applied Surface Sciencevol : 256, no : 11, pp : 3531- 3540(SCI 03 2010)[link]
  22. Chiu TC;Lin KL,"The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing",INTERMETALLICS; INTERMETALLICSvol : 17, no : 12, pp : 1105- 1114(SCI 12 2009)[link]
  23. Kuo SM;Lin KL,"Recrystallization under electromigration of a solder alloy",JOURNAL OF APPLIED PHYSICS; JOURNAL OF APPLIED PHYSICSvol : 106, no : 2, pp : 023514- (SCI 07 2009)[link]
  24. Chiu TC;Lin KL,"The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint",SCRIPTA MATERIALIA; SCRIPTA MATERIALIAvol : 60, no : 12, pp : 1121- 1124(SCI 06 2009)[link]
  25. Hsuan TC;Lin KL,"Microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 469, no : 1-2, pp : 350- 356(SCI 02 2009)[link]
  26. Wu YK;Lin KL;Salam B,"Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 2, pp : 227- 230(SCI 02 2009)[link]
  27. Lai RS;Lin KL;Salam B,"Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 1, pp : 88- 92(SCI 01 2009)[link]
  28. Mittal J;Kuo SM;Lin YW;Lin KL,"Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 12, pp : 2436- 2442(SCI 12 2009)[link]
  29. Yeh TK;Lin KL;Salam B,"Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders",SOLDERING & SURFACE MOUNT TECHNOLOGY; SOLDERING & SURFACE MOUNT TECHNOLOGYvol : 21, no : 4, pp : 19- 23(SCI2009)[link]
  30. Kuo SM;Lin KL,"Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 37, no : 10, pp : 1611- 1617(SCI 10 2008)[link]
  31. Pan CC;Yu CH;Lin KL,"The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn-3.0Ag-0.5Cu on a Cu substrate",APPLIED PHYSICS LETTERS; APPLIED PHYSICS LETTERSvol : 93, no : 06, pp : 1912- 1914(SCI 08 2008)[link]
  32. Chiu YT;Lin KL;Lai YS,"Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 7, pp : 1877- 1881(SCI 07 2008)[link]
  33. Liu NS;Lin KL,"Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 456, no : 1-2, pp : 466- 473(SCI 05 2008)[link]
  34. Huang YL;Lin KL;Liu DS,"The micro-impact fracture behavior of lead-free solder ball joints",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 4, pp : 1057- 1063(SCI 04 2008)[link]
  35. Kuo SM;Lin KL,"Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 4, pp : 1087- 1094(SCI 04 2008)[link]
  36. Lin KL;Shih PC,"IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 452, no : 2, pp : 291- 297(SCI 03 2008)[link]
  37. Lai RS;Lin KL;Salam B,"Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders",SOLDERING & SURFACE MOUNT TECHNOLOGY; SOLDERING & SURFACE MOUNT TECHNOLOGYvol : 20, no : 1, pp : 22- 26(SCI2008)[link]
  38. Mohanty US;Lin KL,"Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution",CORROSION SCIENCE; CORROSION SCIENCEvol : 50, no : 9, pp : 2437- 2443(SCI 09 2008)[link]
  39. Lin KL;Chen SY;Mohanty US,"Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip",JOURNAL OF THE ELECTROCHEMICAL SOCIETY; JOURNAL OF THE ELECTROCHEMICAL SOCIETYvol : 155, no : 4, pp : 251- 255(SCI2008)[link]
  40. Chiu TC;Lin KL,"Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 1, pp : 264- 273(SCI 01 2008)[link]
  41. Shih, PC;Lin, KL,"Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste",Journal of Materials Science; Journal of Materials Sciencevol : 42, no : , pp : 2574- 2581(SCI 04 2007)[link]
  42. Kuo, SM;Lin, KL,"Microstructure evolution during electromigration between Sn-9Zn solder and Cu",J. Materials Research; J. Materials Researchvol : 22, no : , pp : 1240- 1249(SCI 05 2007)[link]
  43. Shih, PC;Lin, KL,"Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C",J. Materials Research; J. Materials Researchvol : 22, no : , pp : 113- 123(SCI 01 2007)[link]
  44. Hsuan, TC;Lin, KL,"Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder",Materials Science & Engineering A; Materials Science & Engineering Avol : 456, no : , pp : 202- 209(SCI 05 2007)[link]
  45. Kuo, SM;Lin, KL,"The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing",J. Electronic Materials; J. Electronic Materialsvol : 36, no : , pp : 1378- 1382(SCI 10 2007)[link]
  46. Shih, PC;Lin, KL,"Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 degrees C reflow",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 439, no : , pp : 137- 142(SCI 07 2007)[link]
  47. Mohanty, US;Lin, KL,"The polarization characteristics of Pb-free Sn-8.5Zn-XAg-0.1A1-0.05Ga alloy in 3.5% NaCl solution",Corrosion Science; Corrosion Sciencevol : 49, no : , pp : 2815- 2831(SCI 07 2007)[link]
  48. Mohanty, US;Lin, KL,"Electrochemical corrosion study of Sn-XAg-0.5Cu alloys in 3.5% NaCl solution",J. Materials Research;J. Materials Researchvol : 22, no : , pp : 2573- 2581(SCI 09 2007)[link]
  49. Yeh, PY;Song, JM;Lin, KL,"Dissolution behavior of Cu and Ag substrates in molten solders",J. Electronic Materials; J. Electronic Materialsvol : 35, no : , pp : 978- 987(SCI 05 2006)[link]
  50. Huang, CW;Lin, KL,"Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates",Journal ofElectronic Materials; Journal ofElectronic Materialsvol : 35, no : , pp : 2135- 2141(SCI 12 2006)[link]
  51. Shih, PC;Lin, KL,"Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 422, no : , pp : 153- 163(SCI 09 2006)[link]
  52. Mohanty, US;Lin, KL,"Potentiodynamic polarization measurement of Sn-8.5Zn-XAl-0.5Ga alloy in 3.5% NaCl solution",Journal of The Electrochemical Society; Journal of The Electrochemical Societyvol : 153, no : , pp : B319- B324(SCI2006)[link]
  53. Mohanty, US;Lin, KL,"Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution",Applied Surface Science; Applied Surface Sciencevol : 252, no : , pp : 5907- 5916(SCI 06 2006)[link]
  54. Chen, KI;Cheng, SC;Wu, S;Lin, KL,"Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 416, no : , pp : 98- 105(SCI 06 2006)[link]
  55. Liu, NS;Lin, KL,"The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu",Scripta Materialia; Scripta Materialiavol : 54, no : , pp : 219- 224(SCI 01 2006)[link]
  56. Mohanty, US;Lin, KL,"The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaCl solution",Corrosion Science; Corrosion Sciencevol : 48, no : , pp : 662- 678(SCI 03 2006)[link]
  57. Yu, CH;Lin, KL,"The atomic-scale studies of the behavior of the crystal dissolution in a molten metal",Chemical Physics Letters; Chemical Physics Lettersvol : 418, no : , pp : 433- 436(SCI 02 2006)[link]
  58. Liu, NS;Lin, KL,"Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders",Scripta Materialia; Scripta Materialiavol : 52, no : , pp : 369- 374(SCI 03 2005)[link]
  59. Cheng, SC;Lin, KL,"Microstructure and mechanical properties of Sn-8.55Zn-1Ag-XAl solder alloys",Materials Trans – JIM; Materials Trans – JIMvol : 46, no : , pp : 42- 47(SCI 01 2005)[link]
  60. Yu, CH;Lin, KL,"Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 1242- 1249(SCI 05 2005)[link]
  61. Hsu, JC;Lin, KL,"The effect of saccharin addition on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposit on Al",Thin Solid Films; Thin Solid Filmsvol : 471, no : , pp : 186- 193(SCI 01 2005)[link]
  62. Yu, CH;Lin, KL,"Early dissolution behavior of copper in a molten Sn-Zn-Ag solder",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 666- 671(SCI 03 2005)[link]
  63. Mohanty, US;Lin, KL,"Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution",Material Science and Engineering A; Material Science and Engineering Avol : 406, no : , pp : 34- 42(SCI 10 2005)[link]
  64. Shih, PC;Lin, KL,"Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 219- 229(SCI 01 2005)[link]
  65. Liu, YH;Lin, KL,"Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 2184- 2193(SCI 08 2005)[link]
  66. Song, JM;Liu, PC;Shih, CL;Lin, KL,"Role of ag in the formation of interfacial intermetallic phases in Sn-Zn soldering",J. Electronic Materials; J. Electronic Materialsvol : 34, no : , pp : 1249- 1254(SCI 09 2005)[link]
  67. Shih, PC;Lin, KL,"Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 2854- 2865(SCI 10 2005)[link]
  68. Chuang, CM;Hung, HT;Liu, PC;Lin, KL,"The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 33, no : , pp : 7- 13(SCI 01 2004)[link]
  69. Chuang, CM;Shih, PC;Lin, KL,"Mechanical strength of Sn-3.5Ag-based solders and related bondings",J. Electronic Materials; J. Electronic Materialsvol : 33, no : , pp : 1- 6(SCI 01 2004)[link]
  70. Liu, YH;Chuang, CM;Lin, KL,"Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 19, no : , pp : 2471- 2477(SCI 08 2004)[link]
  71. Song, JM;Lin, KL,"Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 19, no : , pp : 2719- 2724(SCI 09 2004)[link]
  72. Huang, CW;Lin, KL,"Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer",MATERIALS TRANSACTIONS; MATERIALS TRANSACTIONSvol : 45, no : , pp : 588- 594(SCI 02 2004)[link]
  73. Song, JM;Liu, NS;Lin, KL,"Microstructures, thermal and tensile properties of Sn-Zn-Ga alloys",MATERIALS TRANSACTIONS; MATERIALS TRANSACTIONSvol : 45, no : , pp : 776- 782(SCI 03 2004)[link]
  74. Huang, CW;Lin, KL,"Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C",Journal of Materials Research; Journal of Materials Researchvol : 19, no : , pp : 3560- 3568(SCI 12 2004)[link]
  75. Lin, CT;Lin, KL,"Effects of current density and deposition time on electrical resistivity of electroplated Cu layers",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 15, no : , pp : 757- 762(SCI 11 2004)[link]
  76. Lin, KL;Wu, CH,"Structural evolution of electroless nickel bump",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C273- C276(SCI 05 2003)[link]
  77. Lin, CT;Lin, KL,"Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating",Applied Surface Science; Applied Surface Sciencevol : 214, no : , pp : 243- 258(SCI 05 2003)[link]
  78. Huang, CW;Lin, KL,"Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 1528- 1534(SCI 07 2003)[link]
  79. Lin, KL;Liu, YH,"The cathode current efficiency of flip-chip solder bump plating",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C529- C532(SCI 08 2003)[link]
  80. Cheng, SC;Lin, KL,"Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 degrees C",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 1795- 1803(SCI 08 2003)[link]
  81. Hsu, JC;Lin, KL,"Enhancement in the deposition behavior and deposit properties of electroless Ni-Cu-P",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C653- C656(SCI 09 2003)[link]
  82. Lin, KL;Shih, CL,"Wetting interaction between Sn-Zn-Ag solders and Cu",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 95- 100(SCI 02 2003)[link]
  83. Hsu, JC;Lin, KL,"Effect of internal stress on elemental diffusion and crystallization of electroless Ni-Cu-P deposit on Al",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2221- 2227(SCI 09 2003)[link]
  84. Song, JM;Lin, KL,"Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2060- 2067(SCI 09 2003)[link]
  85. Lin, KL;Sun, LM,"Electrodeposition of eutectic Sn-Zn alloy by pulse plating",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2203- 2207(SCI 09 2003)[link]
  86. Chuang, CM;Lin, KL,"Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1426- 1431(SCI 12 2003)[link]
  87. Lin, KL;Chen, KI;Shi, PC,"A potential drop-in replacement for eutectic Sn-Pb solder - The Sn-Zn-Ag-Al-Ga solder",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1490- 1495(SCI 12 2003)[link]
  88. Lin, CT;Lin, KL,"Preparation of Cu1-xTax films and the material interaction in the Si/Cu1-xTax/Cu structure",Materials Chemistry and Physics; Materials Chemistry and Physicsvol : 82, no : , pp : 306- 315(SCI 11 2003)[link]
  89. Chen, KI;Lin, KL,"The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ga",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1111- 1116(SCI 10 2003)[link]
  90. Lin, KL;Shih, CL,"Microstructure and thermal behavior of Sn-Zn-Ag solders",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1496- 1500(SCI 12 2003)[link]
  91. Cheng, SC;Lin, KL,"The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu",J. Electronic Materials; J. Electronic Materialsvol : 31, no : , pp : 940- 945(SCI 09 2002)[link]
  92. Lin, KL;Hwang, JW,"Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder",IEEE Trans. On Advanced Packaging; IEEE Trans. On Advanced Packagingvol : 25, no : , pp : 509- 513(SCI 11 2002)[link]
  93. Lin, KL;Hwang, JW,"Effect of thiourea and lead acetate on the deposition of electroless nickel",Materials Chemistry and Physics; Materials Chemistry and Physicsvol : 76, no : , pp : 204- 211(SCI 08 2002)[link]
  94. Chen, KI;Lin, KL,"The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - the effect of Ag",J. Electronic Materials; J. Electronic Materialsvol : 31, no : , pp : 861- 867(SCI 08 2002)[link]
  95. Lin, KL;Hsiao, CC;Chen, KI,"Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment",J. Materials Research; J. Materials Researchvol : 17, no : , pp : 2386- 2393(SCI 09 2002)[link]
  96. Lin, KL;Chang, YL;Huang, CC;Li, FI;Hsu, JC,"Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives",Applied Surface Science; Applied Surface Sciencevol : 181, no : , pp : 166- 172(SCI 09 2001)[link]
  97. Chen, CJ;Lin, KL,"Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps",IEEE Trans. On Component and Packaging Technology; IEEE Trans. On Component and Packaging Technologyvol : 24, no : , pp : 691- 697(SCI 12 2001)[link]
  98. Lin, KL;Hsu, HM,"Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact",J. Electronic Materials; J. Electronic Materialsvol : 30, no : , pp : 1068- 1072(SCI 09 2001)[link]
  99. Chen, CJ;Lin, KL,"The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow",J. Electronic Materials; J. Electronic Materialsvol : 29, no : , pp : 1007- 1014(SCI 08 2000)[link]
  100. Lin, KL;Chen, CL,"Intermittent electroless nickel deposition in a fine trench flip chip bump pad",J. Electrochemical Society; J. Electrochemical Societyvol : 147, no : , pp : 2604- 2606(SCI 07 2000)[link]
  101. Chen, CJ;Lin, KL,"Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum",Thin Solid Films; Thin Solid Filmsvol : 370, no : , pp : 106- 113(SCI 07 2000)[link]
  102. Lin, KL;Hsu, KT,"Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths",Plating & Surface Finishing; Plating & Surface Finishingvol : 87, no : , pp : 86- 89(SCI 03 2000)[link]
  103. Lin, KL;Hsu, KT,"Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 657- 660(SCI 12 2000)[link]
  104. Lin, KL;Yao, S,"Solder thickness variation with respect to soldering parameters",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 661- 664(SCI 12 2000)[link]
  105. Lin, KL;Chen, JW,"Wave soldering bumping process incorporating electroless nickel UBM",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 143- 150(SCI 03 2000)[link]
  106. Lin KL;Liu YC,"Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 568- 574(SCI 11 1999)[link]
  107. Lin KL;Liu YC,"Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 575- 579(SCI 11 1999)[link]
  108. Chen CJ;Lin KL,"The deposition and crystallization behaviors of electroless Ni-Cu-P deposits",JOURNAL OF THE ELECTROCHEMICAL SOCIETY; JOURNAL OF THE ELECTROCHEMICAL SOCIETYvol : 146, no : 1, pp : 137- 140(SCI 01 1999)[link]
  109. Lin KL;Liu YT,"Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 580- 585(SCI 11 1999)[link]
  110. Lin KL;Liu TP,"The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 56, no : 2, pp : 171- 176(SCI 10 1998)[link]
  111. Lin KL;Liu TP,"High-temperature oxidation of a Sn-Zn-Al solder",OXIDATION OF METALS; OXIDATION OF METALSvol : 50, no : 3-4, pp : 255- 267(SCI 10 1998)[link]
  112. Lin KL;Chung FC;Liu TP,"The potentiodynamic polarization behavior of Pb-free XIn-9(5Al-Zn)-YSn solders",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 53, no : 1, pp : 55- 59(SCI 04 1998)[link]
  113. Lin KL;Wen LH;Liu TP,"The microstructures of the Sn-Zn-Al solder alloys",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 27, no : 3, pp : 97- 105(SCI 03 1998)[link]
  114. Lin KL;Chao WH,"Material interactions of solder bumps produced with fluxless wave soldering",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 21, no : 1, pp : 59- 64(SCI 02 1998)[link]
  115. Lin KL;Wang YC,"Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 27, no : 11, pp : 1205- 1210(SCI 11 1998)[link]
  116. Lin KL;Wen LH,"The wetting of copper by Al Zn Sn solders",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 9, no : 1, pp : 5- 8(SCI 02 1998)[link]
  117. Lin KL;Chue CH;Kou BC,"Deformation and corrosion of hot dip galvanized coatings",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 50, no : 1, pp : 82- 87(SCI 08 1997)[link]
  118. Lee CY;Lin KL,"Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 8, no : 6, pp : 377- 383(SCI 12 1997)[link]
  119. Lin KL;Chen SK;Chang SY,"Adhesion of multilayer solder pads on silicon",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 8, no : 4, pp : 253- 257(SCI 08 1997)[link]
  120. Chen CJ;Lin KL,"Wetting interactions between the Ni-Cu-P deposit and In-Sn solders",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 20, no : 3, pp : 211- 216(SCI 08 1997)[link]
  121. Lin KL;Chao WH;Wu CD,"The performance and degradation behaviours of the TiAlN/interlayer coatings on drills",SURFACE & COATINGS TECHNOLOGY; SURFACE & COATINGS TECHNOLOGYvol : 89, no : 3, pp : 279- 284(SCI 03 1997)[link]
  122. Lin KL;Chen SK,"The interdiffusion and the feasibility of Al/Mo/Ni/(Pb-Sn) as a solder bump system",THIN SOLID FILMS; THIN SOLID FILMSvol : 295, no : 1-2, pp : 218- 223(SCI 02 1997)[link]
  123. Lin KL;Hwang MY;Wu CD,"The deposition and wear properties of cathodic arc plasma deposition TiAlN deposits",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 46, no : 1, pp : 77- 83(SCI 10 1996)[link]
  124. Lin KL;Chang SY,"The morphologies and the chemical states of the multiple zincating deposits on Al pads of Si chips",THIN SOLID FILMS; THIN SOLID FILMSvol : 288, no : 1-2, pp : 36- 40(SCI 11 1996)[link]
  125. Lin KL;Chang SY,"Approaching a uniform bump height of the electroplated solder bumps on a silicon wafer",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 19, no : 4, pp : 747- 751(SCI 11 1996)[link]
  126. Lin KL;Chang SY,"The morphologies and compositions of electroplated solder bumps on a silicon wafer",PLATING AND SURFACE FINISHING; PLATING AND SURFACE FINISHINGvol : 83, no : 6, pp : 58- 61(SCI 06 1996)[link]
  127. Lin KL;Chen CJ,"The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 7, no : 6, pp : 397- 401(SCI 12 1996)[link]
  128. HO JK;LIN KL,"PREPARATION OF AL-NI ALLOY-FILMS BY ALTERNATE SPUTTER-DEPOSITION",JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS; JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMSvol : 13, no : 4, pp : 2170- 2176(SCI 07 1995)[link]
  129. LIN KL;CHANG JT,"THE COMPOSITION AND MICROSTRUCTURE OF ELECTRODEPOSITED SOLDER ON ELECTROLESS NICKEL IN THE PRESENCE OF GELATIN",JOURNAL OF MATERIALS SCIENCE; JOURNAL OF MATERIALS SCIENCEvol : 30, no : 7, pp : 1879- 1883(SCI 04 1995)[link]
  130. LIN KL;LEE CY;HWANG MY,"WETTING OF METALS WITH CAST-IRON AND 304-STAINLESS-STEEL",JOURNAL OF MATERIALS SCIENCE LETTERS; JOURNAL OF MATERIALS SCIENCE LETTERSvol : 14, no : 18, pp : 1314- 1316(SCI 09 1995)
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