活動與演講
115學年材料系-第七週 專題研討課程 演講公告 (115年10月22日)
發佈日期 :
2026-10-19
最後更新日期 :
2026-10-16
公告分類 :
活動與演講,研究所公告
115學年材料系-第七週 專題研討課程 演講公告 (115年10月22日)
日期：民國 115年 10月 22日(四)
時間：下午 3:20
主講人: 沈育安
題目：Low-Melting Alloy Design and Interfacial Reaction Control for Semiconductor Packaging Interconnects
低熔點合金設計與界面反應控制於半導體封裝接點之應用
簡介:In recent years, semiconductor packaging has attracted significant attention and has been widely applied in advanced semiconductor chips, heterogeneous device integration, power semiconductors, and flexible electronics. Among these technologies, low-melting alloys serve as key interconnect materials between chips and substrates. Their thermal and mechanical properties, as well as their interfacial reactions with packaging metallization layers, are strongly related to the processing temperature and reliability of semiconductor packages. Our group has therefore investigated different low-melting alloy systems to meet the requirements of various packaging processes and applications. This talk aims to share the design concepts of these low-melting alloys, discuss the relationship between alloy properties and microstructure, and connect thermodynamic calculations with microstructure formation mechanisms. Through these discussions, the role of materials science and engineering in semiconductor packaging will be highlighted.
歡迎各位撥冗參加!
日期：民國 115年 10月 22日(四)
時間：下午 3:20
主講人: 沈育安
題目：Low-Melting Alloy Design and Interfacial Reaction Control for Semiconductor Packaging Interconnects
低熔點合金設計與界面反應控制於半導體封裝接點之應用
簡介:In recent years, semiconductor packaging has attracted significant attention and has been widely applied in advanced semiconductor chips, heterogeneous device integration, power semiconductors, and flexible electronics. Among these technologies, low-melting alloys serve as key interconnect materials between chips and substrates. Their thermal and mechanical properties, as well as their interfacial reactions with packaging metallization layers, are strongly related to the processing temperature and reliability of semiconductor packages. Our group has therefore investigated different low-melting alloy systems to meet the requirements of various packaging processes and applications. This talk aims to share the design concepts of these low-melting alloys, discuss the relationship between alloy properties and microstructure, and connect thermodynamic calculations with microstructure formation mechanisms. Through these discussions, the role of materials science and engineering in semiconductor packaging will be highlighted.
歡迎各位撥冗參加!