題目:
Advanced Packaging Connecting a Smarter World

演講者: 張惠政
現職: 台灣積體電路製造股份有限公司 先進封裝技術發展模組開發一處處長
時間: 114年 9月 24日(四) 15:20~17:00 pm
地點: 成功大學成功校區三系館 鋼構區(3F)共同教室A1302演講廳

演講摘要:
The rapid growth of AI and high-performance computing is shifting semiconductor innovation from transistor-level scaling toward system-level integration. Advanced packaging enables this transition by integrating logic, memory, and specialized chiplets through 2.5D and 3D architectures, while fine-pitch interconnects and hybrid bonding provide the bandwidth and connectivity required for increasingly complex systems.
This talk will introduce the evolution of advanced packaging, from heterogeneous integration and 3D stacking to the engineering challenges associated with bonding interfaces, thermal management, warpage, and reliability. It will also highlight the growing importance of materials, chemistry, process engineering, and characterization in enabling future semiconductor technologies, illustrating how fundamental knowledge learned in the classroom can translate into real-world innovation.