活動與演講
115學年材料所-第二週 專題研討課程 演講公告 (115年9月17日)
發佈日期 :
2026-09-17
最後更新日期 :
2026-09-17
公告分類 :
活動與演講
題目:
Application of Chemical Mechanical Polishing (CMP) in Semiconductors
演講者: 侯武桓
現職: 台灣積體電路製造股份有限公司 十八A廠奈米CMP薄膜工程二部 部經理
時間: 114年 9月 17日(四) 15:20~17:00 pm
地點: 成功大學成功校區三系館 鋼構區(3F)共同教室A1302演講廳
演講摘要:
This seminar offers an insider’s perspective on the cutting-edge semiconductor industry. First, we will explore the global semiconductor landscape and TSMC’s technology roadmap, highlighting how innovations drive next-generation chips. Next, we dive into the critical role of Chemical Mechanical Planarization (CMP) in advanced nodes, demonstrating how this essential process enables atomic-level flatness and multi-layer integration. Finally, the talk will demystify the daily life and responsibilities of a TSMC Process Engineer and real-world fab operations. Attendees will gain valuable insights into industry trends, key technologies, and potential career paths within the world's leading foundry.
Application of Chemical Mechanical Polishing (CMP) in Semiconductors
演講者: 侯武桓
現職: 台灣積體電路製造股份有限公司 十八A廠奈米CMP薄膜工程二部 部經理
時間: 114年 9月 17日(四) 15:20~17:00 pm
地點: 成功大學成功校區三系館 鋼構區(3F)共同教室A1302演講廳
演講摘要:
This seminar offers an insider’s perspective on the cutting-edge semiconductor industry. First, we will explore the global semiconductor landscape and TSMC’s technology roadmap, highlighting how innovations drive next-generation chips. Next, we dive into the critical role of Chemical Mechanical Planarization (CMP) in advanced nodes, demonstrating how this essential process enables atomic-level flatness and multi-layer integration. Finally, the talk will demystify the daily life and responsibilities of a TSMC Process Engineer and real-world fab operations. Attendees will gain valuable insights into industry trends, key technologies, and potential career paths within the world's leading foundry.